High-Temperature Polyimide Heat Shrink Tape

Dunstone X Series Hi-Shrink Tape is a heat-shrinkable polyimide tape possessing much higher temperature capabilities than any other shrinkable tape on the market today. Our 208X polyimide tape is often used with polyimides, bismaleimides (BMIs), cyanate esters, phenolics, benzoxazines, phthalonitriles, thermosetting resin systems, and thermoplastic applications.

Product Description

  • .002” thick polyimide shrink
  • Standard slit widths (0.5” up to 2.5”)
  • Supports mechanical usage temperatures up to 400°C
  • Supports electrical usage temperatures up to 220°C

Product Benefits

  • Highest temperature shrinkable film available
  • Ensures a smooth, consistent surface finish
  • Enables multiple methods for adjusting compressive force on the part
  • Useful for curing thermoplastics such as PEEK and PPS resin systems
  • Useful as a mechanical compressive layer or for dielectric insulation
  • Custom widths and narrow/wide web available upon request

Product Characteristics

  • Max shrink percentage of 12%
  • 8% shrink at 150°C and 12% at 350°C
  • Starts to shrink at 158°F (70°C) and functions up to 750ºF (400ºC)
  • Modified polyimide that shrinks in the machine direction when heated
  • Available in perforated form with holes on 1/4” (6 mm) staggered centers